Package Mechanical Specifications
3.4
Package Handling Guidelines
Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
Table 3-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
1 2
Shear
Tensile
356 N [80 lbf]
156 N [35 lbf]
8 N-m [70 lbf-in]
,
2,3
2,4
Torque
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. These guidelines are based on limited testing for design characterization.
3. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top sur-
face.
3.5
Package Insertion Specifications
The Celeron D processor can be inserted into and removed from a mPGA478B socket 15 times.
The socket should meet the mPGA478B requirements detailed in the mPGA479, mPGA478A,
mPGA478B, mPGA478C, and mPGA476 Socket Design Guidelines.
3.6
3.7
Processor Mass Specification
The typical mass of the Celeron D processor is 19 g [0.67 oz]. This mass [weight] includes all the
components that are included in the package.
Processor Materials
Table 3-3 lists some of the package components and associated materials.
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Substrate
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
Substrate Pins
Datasheet
35
INTEL [ INTEL ]
