Package Mechanical Specifications
3.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-out zone
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the
package substrate. See Figure 3-2 and Figure 3-3 for keep-out zones.
The location and quantity of package capacitors may change due to manufacturing efficiencies but
will remain within the component keep-in.
3.3
Package Loading Specifications
Table 3-1 provides dynamic and static load specifications for the processor package. These
mechanical maximum load limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Also, any mechanical system or component testing should
not exceed the maximum limits. The processor package substrate should not be used as a
mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum
loading specification must be maintained by any thermal and mechanical solutions.
.
Table 3-1. Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
1,2,3
Static
44 N [10 lbf]
445 N [100 lbf]
890 N [200 lbf]
667 N [150 lbf]
1,3,4
1,3,5
Dynamic
Transient
—
—
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the
minimum specified load on the processor package.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only and does not include the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load require-
ment.
5. Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement,
representative of loads experienced by the package during heatsink installation.
34
Datasheet
INTEL [ INTEL ]
