21 Package Handling Guidelines......................................................................................39
22 Processor Materials...................................................................................................40
23 Alphabetical Land Assignments...................................................................................46
24 Numerical Land Assignment.......................................................................................56
25 Signal Description ( ) ................................................................................................66
26 Processor Thermal Specifications................................................................................76
27 Thermal Profile.........................................................................................................77
28 Thermal “Diode” Parameters using Diode Model............................................................82
29 Thermal “Diode” Parameters using Transistor Model......................................................83
30 Thermal Diode Interface............................................................................................83
31 GetTemp0() Error Codes ...........................................................................................86
32 Power-On Configuration Option Signals .......................................................................87
33 Fan Heatsink Power and Signal Specifications...............................................................97
6
Datasheet
INTEL [ INTEL ]
