5.2.2 Thermal Monitor 2 ..................................................................................79
5.2.3 On-Demand Mode...................................................................................80
5.2.4 PROCHOT# Signal ..................................................................................81
5.2.5 THERMTRIP# Signal................................................................................81
Thermal Diode...................................................................................................82
Platform Environment Control Interface (PECI) ......................................................84
5.4.1 Introduction...........................................................................................84
5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management .......84
5.4.2 PECI Specifications .................................................................................86
5.4.2.1 PECI Device Address..................................................................86
5.4.2.2 PECI Command Support.............................................................86
5.4.2.3 PECI Fault Handling Requirements...............................................86
5.4.2.4 PECI GetTemp0() Error Code Support ..........................................86
5.3
5.4
6
Features ..................................................................................................................87
6.1
6.2
Power-On Configuration Options ..........................................................................87
Clock Control and Low Power States.....................................................................87
6.2.1 Normal State .........................................................................................88
6.2.2 HALT and Extended HALT Powerdown States ..............................................88
6.2.2.1 HALT Powerdown State ..............................................................88
6.2.2.2 Extended HALT Powerdown State ................................................89
6.2.3 Stop Grant State ....................................................................................89
6.2.4 HALT Snoop State and Stop Grant Snoop State...........................................90
7
Boxed Processor Specifications................................................................................91
7.1
Mechanical Specifications....................................................................................92
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................92
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................94
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....94
Electrical Requirements ......................................................................................94
7.2.1 Fan Heatsink Power Supply ......................................................................94
Thermal Specifications........................................................................................95
7.3.1 Boxed Processor Cooling Requirements......................................................95
7.3.2 Variable Speed Fan.................................................................................97
7.2
7.3
8
Debug Tools Specifications ......................................................................................99
8.1
Logic Analyzer Interface (LAI) .............................................................................99
8.1.1 Mechanical Considerations .......................................................................99
8.1.2 Electrical Considerations..........................................................................99
4
Datasheet