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316963-002 参数 Datasheet PDF下载

316963-002图片预览
型号: 316963-002
PDF下载: 下载PDF文件 查看货源
内容描述: 支持英特尔赛扬处理器 [Supporting the Intel Celeron processor]
分类和应用:
文件页数/大小: 100 页 / 1346 K
品牌: INTEL [ INTEL ]
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Introduction  
1.1.1  
Processor Packaging Terminology  
Commonly used terms are explained here for clarification:  
Intel Celeron Processor 400 Series — Single core processor in the FC-LGA6  
package with a 1 MB or 512 KB L2 cache.  
Processor — For this document, the term processor is the generic form of the Intel  
Celeron processor 400 series. The processor is a single package that contains one  
exectution unit.  
Keep-out zone — The area on or near the processor that system design can not  
use.  
Processor core — Processor core die with integrated L2 cache.  
LGA775 socket — The Intel Celeron processor 400 series mates with the system  
board through a surface mount, 775-land, LGA socket.  
Integrated heat spreader (IHS) —A component of the processor package used  
to enhance the thermal performance of the package. Component thermal solutions  
interface with the processor at the IHS surface.  
Retention mechanism (RM) — Since the LGA775 socket does not include any  
mechanical features for heatsink attach, a retention mechanism is required.  
Component thermal solutions should attach to the processor via a retention  
mechanism that is independent of the socket.  
FSB (Front Side Bus) — The electrical interface that connects the processor to  
the chipset. Also referred to as the processor system bus or the system bus. All  
memory and I/O transactions as well as interrupt messages pass between the  
processor and chipset over the FSB.  
Storage conditions — Refers to a non-operational state. The processor may be  
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or  
exposed to free air. Under these conditions, processor lands should not be  
connected to any supply voltages, have any I/Os biased, or receive any clocks.  
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from  
packaging material) the processor must be handled in accordance with moisture  
sensitivity labeling (MSL) as indicated on the packaging material.  
Functional operation — Refers to normal operating conditions in which all  
processor specifications, including DC, AC, system bus, signal quality, mechanical  
and thermal are satisfied.  
Execute Disable Bit — The Execute Disable bit allows memory to be marked as  
executable or non-executable, when combined with a supporting operating system.  
If code attempts to run in non-executable memory the processor raises an error to  
the operating system. This feature can prevent some classes of viruses or worms  
that exploit buffer over run vulnerabilities and can thus help improve the overall  
security of the system. See the Intel® Architecture Software Developer's Manual  
for more detailed information.  
• Intel® 64 Architecture — An enhancement to Intel's IA-32 architecture, allowing  
the processor to execute operating systems and applications written to take  
advantage of the Intel® 64 architecture. Further details on Intel® 64 architecture  
and programming model can be found in the Intel Extended Memory 64 Technology  
Software Developer Guide at http://developer.intel.com/technology/  
64bitextensions/.  
10  
Datasheet