314915-002 参数 Datasheet PDF下载

型号：	314915-002
PDF下载：	下载PDF文件查看货源
内容描述：	双核英特尔®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用：
文件页数/大小：	102 页 / 2420 K
品牌：	INTEL [ INTEL CORPORATION ]

Contents

Introduction

............................................................................................................ 11

1.1

Terminology ..................................................................................................... 11

1.1.1 Processor Terminology ............................................................................ 12

1.2

References ....................................................................................................... 13

Electrical Specifications

........................................................................................... 15

2.1

Power and Ground Lands.................................................................................... 15

2.2

Decoupling Guidelines ........................................................................................ 15

2.2.1 VCC Decoupling ..................................................................................... 15

2.2.2 Vtt Decoupling ....................................................................................... 15

2.2.3 FSB Decoupling...................................................................................... 16

2.3

Voltage Identification ......................................................................................... 16

2.4

Market Segment Identification (MSID) ................................................................. 18

2.5

Reserved, Unused, and TESTHI Signals ................................................................ 18

2.6

...................................................................................................................... 19

2.7

Voltage and Current Specification ........................................................................ 19

2.7.1 Absolute Maximum and Minimum Ratings .................................................. 19

2.7.2 DC Voltage and Current Specification ........................................................ 20

2.7.3 V

Overshoot ....................................................................................... 24

2.7.4 Die Voltage Validation ............................................................................. 24

2.8

Signaling Specifications...................................................................................... 25

2.8.1 FSB Signal Groups.................................................................................. 25

2.8.2 CMOS and Open Drain Signals ................................................................. 27

2.8.3 Processor DC Specifications ..................................................................... 27

2.8.3.1 GTL+ Front Side Bus Specifications ............................................. 29

2.8.4 Clock Specifications ................................................................................ 29

2.8.5 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29

2.8.6 FSB Frequency Select Signals (BSEL[2:0])................................................. 30

2.8.7 Phase Lock Loop (PLL) and Filter .............................................................. 30

2.8.8 BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30

2.8.9 BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32

2.9

PECI DC Specifications ....................................................................................... 33

Package Mechanical Specifications

.......................................................................... 35

3.1

Package Mechanical Drawing............................................................................... 36

3.1.1 Processor Component Keep-Out Zones ...................................................... 40

3.1.2 Package Loading Specifications ................................................................ 40

3.1.3 Package Handling Guidelines.................................................................... 40

3.1.4 Package Insertion Specifications............................................................... 40

3.1.5 Processor Mass Specification .................................................................... 41

3.1.6 Processor Materials................................................................................. 41

3.2

Processor Markings............................................................................................ 41

3.2.1 Processor Land Coordinates ..................................................................... 43

Land Listing and Signal Descriptions

....................................................................... 45

4.1

Processor Land Assignments ............................................................................... 45

4.2

Alphabetical Signals Reference ............................................................................ 68

Thermal Specifications and Design Considerations

.................................................. 75

5.1

Processor Thermal Specifications ......................................................................... 75

5.1.1 Thermal Specifications ............................................................................ 75

5.1.2 Thermal Metrology ................................................................................. 80

5.2

Processor Thermal Features ................................................................................ 80

Dual-Core Intel® Xeon® Processor 3000 Series Datasheet

IC37:专业IC行业平台

专业IC领域供求交易平台:提供全面的IC Datasheet资料和资讯，Datasheet 1000万数据，IC品牌1000多家。

网站导航 Datasheet资料库电子术语电子百科

服务中心 常见问题委托交易会员服务

关于我们 公司简介联系我们免责申明

产品索引：A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9

深圳网络警察报警平台公共信息安全网络监察经营性网站备案信息不良信息举报中心工商网监电子标识全国公安机关备案