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314915-002 参数 Datasheet PDF下载

314915-002图片预览
型号: 314915-002
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 102 页 / 2420 K
品牌: INTEL [ INTEL ]
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Electrical Specifications  
2.7.3.1  
GTL+ Front Side Bus Specifications  
In most cases, termination resistors are not required as these are integrated into the  
processor silicon. See Table 2-9 for details on which GTL+ signals do not include on-die  
termination.  
Valid high and low levels are determined by the input buffers by comparing with a  
reference voltage called GTLREF. Table 2-15 lists the GTLREF specifications. The GTL+  
reference voltage (GTLREF) should be generated on the system board using high  
precision voltage divider circuits.  
Table 2-15. GTL+ Bus Voltage Definitions  
1
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Notes  
2
GTLREF_PU  
GTLREF pull up resistor on  
Mukilteo-2 (3000/3010) chipset  
family boards  
124 * 0.99  
124  
124 * 1.01  
Ω
2
GTLREF_PD  
GTLREF pull down resistor on  
Mukilteo-2 (3000/3010) chipset  
family boards  
210 * 0.99  
210  
210 * 1.01  
Ω
2
2
GTLREF_PU  
GTLREF_PD  
GTLREF pull up resistor on  
100 * 0.99  
200 * 0.99  
100  
200  
100 * 1.01  
200 * 1.01  
Ω
Ω
Bearlake chipset family boards  
GTLREF pull down resistor on  
Bearlake chipset family boards  
3
4
4
R
Termination Resistance  
COMP Resistance  
45  
50  
55  
Ω
Ω
Ω
TT  
COMP[3:0]  
COMP8  
49.40  
24.65  
49.90  
24.90  
50.40  
25.15  
COMP Resistance  
Notes:  
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.  
2. GTLREF is to be generated from V by a voltage divider of 1% resistors (one divider for each GTLEREF land).  
TT  
Refer to the applicable platform design guide for implementation details.  
3. R is the on-die termination resistance measured at V /3 of the GTL+ output driver. Refer to the appropriate  
TT  
TT  
platform design guide for the board impedance. Refer to processor I/O buffer models for I/V characteristics.  
4. COMP resistance must be provided on the system board with 1% resistors. See the applicable platform design  
guide for implementation details. COMP[3:0] and COMP8 resistors are to V  
.
SS  
2.7.4  
2.7.5  
Clock Specifications  
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking  
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the  
processor. As in previous generation processors, the processor’s core frequency is a  
multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its  
default ratio during manufacturing. Refer to Table 2-16 for the processor supported  
ratios.  
The processor uses a differential clocking implementation. For more information on the  
processor clocking, contact your Intel Field representative. Platforms using a CK505  
Clock Synthesizer/Driver should comply with the specifications in Section 2.7.8.  
Platforms using a CK410 Clock Synthesizer/Driver should comply with the specifications  
in Section 2.7.9.  
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet  
29