Boxed Processor Specifications
7
Boxed Processor Specifications
The Celeron D processor will also be offered as an Intel boxed processor. Intel boxed
processors are intended for system integrators who build systems from baseboards and
standard components. The Boxed Celeron D processor will be supplied with a cooling
solution. This chapter documents baseboard and system requirements for the cooling
solution that will be supplied with the boxed Celeron D processor. This chapter is
particularly important for OEMs that manufacture baseboards for system integrators.
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets]. Figure 16 shows a mechanical representation of a boxed Celeron
D processor.
Note:
• Drawings in this section reflect only the specifications on the Intel boxed processor
product. These dimensions should not be used as a generic keep-out zone for all
cooling solutions. It is the system designers’ responsibility to consider their
proprietary cooling solution when designing to the required keep-out zone on their
system platforms and chassis. Refer to the appropriate processor Thermal and
Mechanical Design Guidelines (see Section 1.2) for further guidance. Contact your
local Intel Sales Representative for this document.
Figure 16.
Mechanical Representation of the Boxed Processor
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Celeron D processor.
The boxed processor will be shipped with an unattached fan heatsink. Figure 16 shows
a mechanical representation of the boxed Celeron D processor.
Datasheet
89
INTEL [ INTEL ]
