Boxed Processor Specifications
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in Figure 17 (Side View), and Figure 18 (Top View).
The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in Figure 22 and Figure 23. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
Figure 17.
Space Requirements for the Boxed Processor (Side View: applies to all four
side views)
95.0
[3.74]
81.3
[3.2]
10.0
25.0
[0.39]
[0.98]
Figure 18.
Space Requirements for the Boxed Processor (Top View)
95.0
[3.74]
95.0
[3.74]
NOTES:
1.
The boxed Celeron D processor in the 775-land package cooling solution with clip is
currently under development and, at this time, is preliminary. The diagrams shown may
not reflect the final product.
2.
Diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
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Datasheet
INTEL [ INTEL ]
