Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
4.1.2
Thermal Diode
The processor incorporates an on-die diode that may be used to monitor the die temperature
(junction temperature). A thermal sensor located on the motherboard, or a stand-alone
measurement kit, may monitor the die temperature of the processor for thermal management or
instrumentation purposes. Table 32 and Table 33 provide the diode parameter and interface
specifications.
The processor uses an Integrated Heat Spreader (IHS) and has a case temperature requirement.
Please see the Intel® Pentium® III Processor in the FC-PGA2, 370-pin Package Thermal Design
Guidelines document for details on measuring the case temperature. The thermal diode should be
used for system thermal management and not determining spec compliance.
Table 32. Thermal Diode Parameters
1
Symbol
Parameter
Min
Typ
Max
Unit
Notes
Ifw
n
Forward Bias Current
Diode Ideality Factor
Forward Bias Current
Diode Ideality Factor
5
N/A
150
µA
1
1.001452
5
1.007152
N/A
1.012852
300
2, 4, 5
1
Ifw
n
µA
1.000807
1.009528
1.018249
3, 4, 5
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Characterized at 75° C with a forward bias current of 5 – 150 µA.
3. Characterized at 75° C with a forward bias current of 5 – 300 µA.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
equation:
Ifw=Is(e^ ((Vd*q)/(nkT)) - 1), where Is = saturation current, q = electronic charge, Vd = voltage across the
diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin).
5. Not 100% tested. Specified by design characterization.
Table 33. Thermal Diode Interface
Pin Name
PGA370 Socket pin #
Pin Description
THERMDP
THERMDN
AL31
AL29
diode anode (p_junction)
diode cathode (n_junction)
4.2
Thermal Metrology
The thermal metrology for the processor in the FC-PGA2 package should be followed to evaluate
the thermal performance of proposed cooling solutions. The thermal metrology is contained in the
Intel® Pentium® III Processor in the FC-PGA2, 370-pin Package Thermal Design Guidelines.
Please contact your local Intel field office to obtain this document.
52
Datasheet
INTEL [ INTEL ]
