Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
5.0
Mechanical Specifications
The processor uses a FC-PGA2 package technology. Mechanical specifications for the processor
are given in this section. See Section 1.1.1 for a complete terminology listing.
The processor utilizes a PGA370 socket for installation into the motherboard. Details on the socket
are available in the 370-Pin Socket (PGA370) Design Guidelines.
Note: For Figure 23, the following apply:
1. Unless otherwise specified, the following drawings are dimensioned in inches.
2. All dimensions provided with tolerances are guaranteed to be met for all normal production
product.
3. Figures and drawings labeled as “Reference Dimensions” are provided for informational
purposes only. Reference dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference dimensions are
NOT checked as part of the processor manufacturing. Unless noted as such, dimensions in
parentheses without tolerances are reference dimensions.
4. Drawings are not to scale.
5.1
FC-PGA2 Mechanical Specifications
The following figure with package dimensions is provided to aid in the design of heatsink and clip
solutions as well as demonstrate where pin-side capacitors will be located on the processor.
Table 34 includes the measurements for these dimensions in both inches and millimeters.
Figure 23. Package Dimensions
Datasheet
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INTEL [ INTEL ]
