Intel® Celeron® Processor for PGA370 up to 1.40 GHz on 0.13 µ Process
Table 34. The Processor Package Dimensions
Millimeters
Symbol
Inches
Minimum
Maximum
Notes
Minimum
Maximum
Notes
A1
A2
B1
B2
C1
C2
D
2.266
0.980
2.690
1.180
0.089
0.038
1.212
1.212
0.106
0.047
1.229
1.229
30.800
30.800
31.200
31.200
33.000 max
33.000 max
49.428
1.299 max
1.299 max
49.632
45.974
17.780
17.780
0.889
1.946
1.790
0.000
0.000
0.000
1.954
1.810
0.700
0.700
0.035
D1
G1
G2
G3
H
45.466
0.000
0.000
0.000
2.540
Nominal
0.100
Nominal
L
3.048
0.431
3.302
0.483
0.120
0.017
0.130
0.019
ΦP
Pin TP
0.508 Diametric True Position (Pin-to-Pin)
0.020 Diametric True Position (Pin-to-Pin)
NOTE: Capacitors will be placed on the pin-side of the FC-PGA2 package in the area defined by G1, G2, and
G3. This area is a keepout zone for motherboard designers.
For Table 35, the following apply:
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads
Table 35. Processor Case Loading Parameters
1
2,3
Parameter
IHS Surface
Dynamic (max)
Static (max)
Unit
200
125
75
100
N/A
N/A
lbf
lbf
ibf
IHS Edge
IHS Corner
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. Please see socket manufacturer’s force loading specification also to ensure compliance. Maximum static
loading listed here does not account for the maximum reaction forces on the socket tabs or pins.
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Datasheet
INTEL [ INTEL ]
