XMC1300
XMC1000 Family
General Device Information
2.2.1
Package Pin Summary
The following general building block is used to describe each pin:
Table 4
Function
Px.y
Package Pin Mapping Description
Package A
Package B
...
Pad Type
N
N
Pad Class
The table is sorted by the “Function” column, starting with the regular Port pins (Px.y),
followed by the supply pins.
The following columns, titled with the supported package variants, lists the package pin
number to which the respective function is mapped in that package.
The “Pad Type” indicates the employed pad type:
•
•
•
•
•
STD_INOUT(standard bi-directional pads)
STD_INOUT/AN (standard bi-directional pads with analog input)
High Current (high current bi-directional pads)
STD_IN/AN (standard input pads with analog input)
Power (power supply)
Details about the pad properties are defined in the Electrical Parameters.
Table 5
Package Pin Mapping
Function VQFN TSSOP VQFN TSSOP Pad Type
Notes
40
23
24
25
26
27
28
29
30
33
34
35
36
37
38
17
18
19
20
21
22
23
24
27
28
29
30
31
24
15
-
16
7
-
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P0.8
P0.9
P0.10
P0.11
P0.12
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
STD_INOUT
-
-
-
-
-
-
16
17
18
19
20
-
8
9
10
11
12
-
-
-
21
-
Data Sheet
20
V1.3, 2014-02
Subject to Agreement on the Use of Product Information
INFINEON [ Infineon ]
