XMC1300
XMC1000 Family
General Device Information
Notes
Table 5
Package Pin Mapping
Function VQFN TSSOP VQFN TSSOP Pad Type
40
15
31
32
38
10
25
26
-
24
10
-
16
6
-
VDDP
VSSP
VDDP
VSSP
Power
Power
Power
Power
I/O port supply
I/O port ground
I/O port supply
-
-
Exp.
Pad
Exp.
Pad
-
Exposed Die Pad
The exposed die
pad is connected
internally to VSSP.
For proper
operation, it is
mandatory to
connect the
exposed pad to the
board ground.
For thermal
aspects, please
refer to the
Package and
Reliability chapter.
Data Sheet
22
V1.3, 2014-02
Subject to Agreement on the Use of Product Information