BTS 611 L1
Thermal Characteristics
Parameter and Conditions
Symbol
Values
Unit
min
typ
max
K/W
Thermal resistance
chip - case, both channels: RthJC
--
--
--
--
--
--
3.5
7.0
75
each channel:
junction - ambient (free air):
SMD version, device on PCB5):
R
thJA
37
Electrical Characteristics
Parameter and Conditions, each channel
Symbol
Values
Unit
at Tj = 25 °C, V = 12 V unless otherwise specified
bb
min
--
typ
max
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1 or 7)
RON
IL = 1.8 A
T=25 °C:
j
160
200
400
mΩ
each channel
T=150 °C:
j
320
2.3
4.4
Nominal load current, ISO Norm (pin 4 to 1 or 7)
VON = 0.5 V, T = 85 °C each channel: IL(ISO)
both channels parallel:
1.8
3.5
--
--
A
C
Output current (pin 1 or 7) while GND disconnected
IL(GNDhigh)
--
--
10 mA
or GND pulled up, V =30 V, V = 0, see diagram
bb
IN
page 8
Turn-on time
Turn-off time
IN
IN
to 90% VOUT: ton
to 10% VOUT: toff
80
80
200
200
400
400
µs
RL = 12 Ω, T =-40...+150°C
j
Slew rate on
10 to 30% VOUT, RL = 12 Ω, T =-40...+150°C
dV /dton
-dV/dtoff
0.1
0.1
--
--
1 V/µs
1 V/µs
j
Slew rate off
70 to 40% VOUT, RL = 12 Ω, T =-40...+150°C
j
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for V
connection. PCB is vertical without blown air.
5)
bb
Semiconductor Group
3
INFINEON [ Infineon ]
