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IBMN325404CT3B-75H 参数 Datasheet PDF下载

IBMN325404CT3B-75H图片预览
型号: IBMN325404CT3B-75H
PDF下载: 下载PDF文件 查看货源
内容描述: [Synchronous DRAM, 64MX4, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54]
分类和应用: 时钟动态存储器光电二极管内存集成电路
文件页数/大小: 66 页 / 1699 K
品牌: IBM [ IBM ]
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IBMN325164CT3  
IBMN325404CT3  
IBMN325804CT3  
256Mb Synchronous DRAM - Die Revision B  
Preliminary  
Absolute Maximum Ratings  
Symbol  
Parameter  
Power Supply Voltage  
Rating  
Units  
V
Notes  
V
-0.3 to +4.6  
-0.3 to +4.6  
1
1
1
1
1
1
1
1
DD  
V
Power Supply Voltage for Output  
Input Voltage  
V
DDQ  
V
-0.3 to V +0.3  
V
IN  
DD  
V
Output Voltage  
-0.3 to V +0.3  
V
OUT  
DD  
T
Operating Temperature (ambient)  
Storage Temperature  
Power Dissipation  
0 to +70  
-55 to +125  
1.0  
°C  
°C  
W
A
T
STG  
P
D
I
Short Circuit Output Current  
50  
mA  
OUT  
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a  
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli-  
ability.  
Recommended DC Operating Conditions (TA = 0°C to 70°C)  
Rating  
Symbol  
Parameter  
Units  
Notes  
Min.  
3.0  
Typ.  
3.3  
3.3  
Max.  
3.6  
V
Supply Voltage  
V
V
V
V
1
DD  
V
Supply Voltage for Output  
Input High Voltage  
3.0  
3.6  
1
DDQ  
V
2.0  
V
+ 0.3  
DD  
1, 2  
1, 3  
IH  
V
Input Low Voltage  
-0.3  
0.8  
IL  
1. All voltages referenced to V and V  
.
SSQ  
SS  
2. V (max) = V + 1.2V for pulse width 5ns.  
IH  
DD  
3. V (min) = V - 1.2V for pulse width 5ns.  
IL  
SS  
Capacitance (TA = 25°C, f = 1MHz, VDD = 3.3V ± 0.3V)  
Symbol  
Parameter  
Min.  
Typ  
3.0  
2.8  
4.5  
Max.  
Units  
Notes  
Input Capacitance (A0-A12, BA0, BA1, CS, RAS, CAS, WE, CKE, DQM)  
Input Capacitance (CK)  
2.5  
2.5  
4.0  
3.8  
3.5  
6.5  
pF  
pF  
pF  
1
1
1
C
I
C
Output Capacitance (DQ0 - DQ15)  
O
1. Multiply given planar values by 2 for 2-High stacked device except CS and CKE.  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
06K0608.F39375A  
10/00  
Page 34 of 66  
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