Figure 4-2. PowerPC 970FX Microprocessor Mechanical Package, Leaded, for DD3.1x Parts (top and side)
45L5867 (576)
SOLDERBALL
Side View
(2X) (6.15)
(2x) (2.05)
(8X) (1.6)
(2X) (6.15)
(2x) (2.05)
CAPACITOR (8)
0612 CAPACITOR
5
5
6
32R8131
CHIP CARRIER ASM
5
CHIP
2
14
A
A01 CORNER
(CHIP CARRIER)
C4 ENCAPSULANT
7
CAPACITOR
C4 ENCAPSULANT
FILLET
CHIP
A
E
D
2
A
1
0.81 ± 0.1
Top View
( 9.4 )
( 25 ± 0.2 )
(1.35 MAX)
(1.08 MIN)
B
2
(2.26 MAX)
(1.82 MIN)
Legend
(8X) (0.59 MAX)
(8X) (1.94 MAX)
(8X) (2.85 MAX)
1
2
3
DATUM A is the center plane of feature labeled DATUM A.
DATUM B is the center plane of feature labeled DATUM B.
Unless otherwise specified part is symmetrical about centerlines defined by DATUMs A and B.
Where not otherwise defined, centerlines indicated are to be interpreted as a datum frame work, established by DATUM
D, A, and B respectively.
(0.908 MAX)
(0.779 MIN)
4
7
(2.258 MAX)
(1.859 MIN)
This line defines the approximate boundary configuration of encapsulant as dispensed. For underfill requirements see IBM
Engineering Specification 71X8781 Module Encapsulation Specification.
(3.168 MAX)
(2.569 MIN)
0.15 C
C
SEATING PLANE
IBM [ IBM ]
