Data Sheet
PowerPC 970FX
Preliminary
4. PowerPC 970FX Microprocessor Dimension and Physical
Signal Assignments
IBM’s PowerPC 970FX uses a ceramic ball grid array (CBGA) that supports 576 balls. Two different
substrates are used for the PowerPC 970FX. Both packages are shown. Note that they are identically
dimensioned.
4.1 ESD Considerations
This product has been ESD tested to meet or exceed the specifications for Class 1B for HBM in JEDEC spec
JESD22-A114-B. Appropriate ESD handling procedures should be implemented and maintained for any facil-
ities handling this component.
4.2 Mechanical Packaging
4.2.1 Leaded Package Version
Figure 4-1 and Figure 4-2 show the side and top views of the packages including the height from the top of
the die to the bottom of the solder balls. Figure 4-3 shows a bottom view of the PowerPC 970FX.
PowerPC 970FX Microprocessor Dimension and Physical
Signal Assignments
Page 40 of 74
October 14, 2005
IBM [ IBM ]
