Data Sheet
Preliminary
PowerPC 970FX
Figure 4-4 and Figure 4-5 show the side and top views of the packages including the height from the top of
the die to the bottom of the solder balls. Figure 4-6 shows a bottom view of the PowerPC 970FX.
Figure 4-4. PowerPC 970FX Microprocessor for Mechanical Package, Reduced-Lead, for DD3.0x Parts (top
and side)
1.35 max, 1.08 min
0.908 max, 0.779 min
(8X) (0.59 max)
(0.55 max)
Side View
(0.35 min)
(2.258 max)
(1.859 min)
( 7.07 )
(2.808 max)
(2.209 min)
Top View
Legend
1
DATUM A is the center plane of feature labeled DATUM A.
DATUM B is the center plane of feature labeled DATUM B.
2
3
Unless otherwise specified part is symmetrical about centerlines defined by DATUMs A and B.
Where not otherwise defined, centerlines indicated are to be interpreted as a datum frame work, established by DATUM
D, A, and B respectively.
4
7
This line defines the approximate boundary configuration of encapsulant as dispensed.
PowerPC 970FX Microprocessor Dimension and Physical
October 14, 2005
Signal Assignments
Page 45 of 74