Datasheet
PowerPC 970FX RISC Microprocessor
Figure 5-3. PowerPC 970FX Thermal Diode Implementation
Low Temp TD Reading
12 bits
12 bits
! Two voltages and tw
stored in fuse string
Elevated Temp TD Reading
! Low Temp = -40C +
(range: -40 to 88C)
Low Temperature
7 bits
Elevated Temperature 7 bits
! Elevated Temp = 1C
(range: 0 to 128C)
! Voltage (mV) = (fus
(range = 300 to 2348
Voltage
mV low
! After correlation betw
User (part ON) vs IB
can use IBM’s slope
determine Set Point
mV elev
User's (mV)
Set Point
Temp
Low
Temp
Elevated
Temp
User's
Max Temp
Table 5-9. Thermal Diode Data Encoding
Offset within First 64-Bit
Read
Field Name
Ring Position
Length in Bits
Adjustment
temp_low
temp_high
1546:1552
1553:1559
1560:1571
1572:1583
39:46
32:38
20:31
8:19
7
7
Value - 40
None
voltage_low
voltage_high
12
12
Value/2 + 300
Value/2 + 300
Note: All values are stored least-significant bit to most-significant bit (bit reversed). They should be bit-swapped before applying the
adjustments shown in this table. Temperatures are stored in degrees centigrade and voltages are stored in millivolts.
5.8.3 Heatsink Attachment and Mounting Forces
Table 5-10 and Figure 5-4 on page 77 describe the allowable forces for the PowerPC 970FX package. The
heatsink design should not exceed these static or dynamic forces.
Table 5-10. Allowable Forces on the PowerPC 970FX RISC Microprocessor Package (Page 1 of 2)
Callout
Number
1
Characteristic
Symbol
Maximum
Unit
Note
Static
F
F
133.5
133.5
N
N
C
C
1
Compressive force on chip
Dynamic
Note:
1. One newton = 0.2248089 pound-force.
2. The maximum force value for callout item 3 must include the force value for callout item 1.
(F + F < F
)
BGA(Static)
BGA
C(Static)
System Design Information
Page 76 of 78
Version 2.5
March 26, 2007
IBM [ IBM ]
