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IBM25PPC970FX6UB186ET 参数 Datasheet PDF下载

IBM25PPC970FX6UB186ET图片预览
型号: IBM25PPC970FX6UB186ET
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 64-Bit, 1600MHz, CMOS, CBGA576, 25 X 25 MM, 1 MM PITCH, CERAMIC, BGA-576]
分类和应用: 时钟外围集成电路
文件页数/大小: 78 页 / 3525 K
品牌: IBM [ IBM ]
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Datasheet  
PowerPC 970FX RISC Microprocessor  
5.4 Decoupling Recommendations  
Capacitor decoupling is required for the PowerPC 970FX. Decoupling capacitors act to reduce high-  
frequency chip switching noise and to provide localized bulk charge storage to reduce major power surge  
effects. Recommendations for high-frequency noise decoupling are provided. Bulk decoupling requires a  
more complete understanding of the system and system power architecture, and is beyond the scope of this  
document.  
High-frequency decoupling capacitors should be located as close as possible to the processor with low lead  
inductance to the ground and voltage planes. The recommended placement of the decoupling capacitors is  
shown in Figure 5-2 on page 68. The decoupling layout is divided into three groups:  
• Group 1 is located in the center of the package and under the PowerPC 970FX die.  
• Group 2 includes Group 1 and is located in the center of the package and under the PowerPC 970FX die.  
• Group 3, located adjacent to Group 2 (which includes Group 1), lies under the module footprint. Printed  
circuit board vias for the decoupling capacitors should ideally be through-type vias with via-in-pad for low  
impedance.  
The recommended decoupling capacitor specifications are provided in Table 5-4.  
Table 5-4. Recommended Decoupling Capacitor Specifications  
Specification  
Size  
Value  
0402 (1.00 × 0.50 mm)  
100 nF  
Capacitance  
Dielectric type  
Voltage rating  
Y5V or X7R  
10 V  
The minimum recommended number of decoupling capacitors for Group 1 and Group 2 is provided  
inTable 5-5.  
Table 5-5. Recommended Minimum Number of Decoupling Capacitors (See Figure 5-2 on page 68)  
Group 2  
Group 1  
Group 3  
Includes all balls in the area defined by a  
dotted-green rectangle from F7 to W18.  
Also includes all balls in Group 1.  
Includes all balls in the area defined by a red  
rectangle from H9 to U16.  
Includes all balls on the chip not in  
Groups 1 and 2.  
Minimum of 40:  
Minimum of 35 V - GND  
Minimum of 80 capacitors  
DD  
33 V - GND  
DD  
(including all 12 OV capacitors)  
Minimum of 4 OV - GND  
DD  
DD  
7 OV - GND  
DD  
Note: Add additional decoupling capacitors to improve noise performance.  
5.4.1 Using the KVPRBVDD and KVPRBGND Pins  
The PowerPC 970FX features one pair of VDD and GND pins to assist in analyzing on-chip noise and voltage  
drop. These pins should not be connected into the normal VDD and GND planes, but should be brought out to  
test pads by traces that are as short as possible. An oscilloscope can be used on these test pads to measure  
on-chip VDD noise and thus to verify the decoupling and voltage regulation in a design. If these pins are not  
needed, they should be left unconnected.  
Version 2.5  
System Design Information  
Page 67 of 78  
March 26, 2007