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IBM25PPC750L-GB500AD2R 参数 Datasheet PDF下载

IBM25PPC750L-GB500AD2R图片预览
型号: IBM25PPC750L-GB500AD2R
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
• Integrated power management  
- Low-power 2.0/3.3V design.  
- Three static power saving modes: doze, nap, and sleep.  
- Automatic dynamic power reduction when internal functional units are idle.  
• Integrated Thermal Management Assist Unit  
- On-chip thermal sensor and control logic.  
- Thermal Management Interrupts for software regulation of junction temperature.  
Testability  
- JTAG interface.  
General Parameters  
The following list provides a summary of the general parameters of the 750.  
Technology  
0.20µm CMOS (general lithography), six-layer copper metallization  
0.12 ± 0.04µm Leff  
Die Size  
5.14mm x 7.78mm (40mm2)  
Transistor count  
Logic design  
Package  
6.35 million  
Fully-static  
740: Surface mount 21x21mm, 255-lead ceramic ball grid array (CBGA)  
750: Surface mount 25x25mm, 360-lead ceramic ball grid array (CBGA)  
PPC 740/PPC 750 core  
power supply  
2V Nominal (see Application Conditions)  
3.3V 2.5V, or 1.8V (Nominal Selectable)  
I/O power supply  
Page 9  
Version 2.0  
9/6/2002  
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