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IBM25PPC750L-GB500AD2R 参数 Datasheet PDF下载

IBM25PPC750L-GB500AD2R图片预览
型号: IBM25PPC750L-GB500AD2R
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
Recommended Operating Conditions  
Characteristic  
Symbol  
VDD  
Value  
See Note 2  
VDD  
Unit  
V
Notes  
Core supply voltage  
1, 2  
1
PLL supply voltage  
AVDD  
V
L2DLL supply voltage  
L2AVDD  
OVDD(3.3V)  
OVDD(2.5V)  
OVDD(1.8V)  
L2OVDD(3.3V)  
L2OVDD(2.5V)  
L2OVDD(1.8V)  
VIN(60X)  
VDD  
V
1
60x bus supply voltage, pin W1 tied high  
60x bus supply voltage pin W1 tied to HRESET  
60x bus supply voltage, pin W1 tied to GND  
L2 bus supply voltage, pin A19 tied high  
L2 bus supply voltage, pin A19 tied to HRESET  
L2 bus supply voltage, pin A19 tied to GND  
3.135 to 3.465  
2.375 to 2.625  
1.71 to 1.89  
3.135 to 3.465  
2.375 to 2.625  
1.71 to 1.89  
GND to OVDD  
GND to L2OVDD  
-40 to 105  
V
1
V
1
V
1
V
1
V
1
V
1
Input voltage (Under AC conditions, inputs must go rail-to-  
rail for maximum AC timing performance.)  
V
1
VIN(L2)  
V
1
Die-junction temperature  
TJ  
°C  
1, 2  
Note:  
1. These are recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.  
2. VDD and TJ are specified by the Application Conditions designator in the part number. See the Part Number Key on page 51 for more information.  
Package Thermal Characteristics1  
Characteristic  
Symbol  
740  
750  
Unit  
Thermal resistance, junction-to-case (top surface  
of die) typical  
θJC  
0.03  
0.03  
°C/W  
2
2
Thermal resistance, junction-to-balls, typical  
θJB  
°C/W  
3.8 - 7.1  
16.0  
3.8 - 7.6  
Thermal resistance, junction-to-ambient, at air-  
flow, no heat sink, typical  
50 FPM  
100 FPM  
150 FPM  
200 FPM  
15.1  
°C/W  
°C/W  
°C/W  
°C/W  
15.4  
16.4  
14.9  
14.2  
14.4  
13.7  
2
Package Size  
Die Size  
Note:  
21 x 21  
25 x 25  
mm  
2
5.12 x 7.78  
5.12 x 7.78  
mm  
1. Refer to Section “Thermal Management Information,” on page 45 for more information about thermal management.  
2. 3.8°C/W is the theoretical θ mounted to infinite heat sink. The larger number applies to a module mounted on a 1.8 mm thick, 2P card using 1 oz cop-  
per power/gnd planes, with JaBn effective area for heat transfer of 75mm x 75mm.  
The 750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-ana-  
log converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the PowerPC  
740 and PowerPC 750 User’s Manual for more information on the use of this feature. Specifications for the  
thermal sensor portion of the TAU are found in the table below.  
Page 11  
Version 2.0  
9/6/2002  
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