PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
PowerPC 750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 750 ceramic ball grid array 360 CBGA
packages.
Figure 16 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 16. Pinout of the 750 360 CBGA Package as Viewed from the Top Surface
17
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
18 19
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Part B
W
Not to Scale
Substrate Assembly.
Encapsulation
View
Die
9/6/2002
Version 2.0
Page32
IBM [ IBM ]
