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IBM25PPC750L-GB500AD2R 参数 Datasheet PDF下载

IBM25PPC750L-GB500AD2R图片预览
型号: IBM25PPC750L-GB500AD2R
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
PowerPC 750 Microprocessor Pin Assignments  
The following sections contain the pinout diagrams for the PowerPC 750 ceramic ball grid array 360 CBGA  
packages.  
Figure 16 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B  
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.  
Figure 16. Pinout of the 750 360 CBGA Package as Viewed from the Top Surface  
17  
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16  
18 19  
Part A  
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Part B  
W
Not to Scale  
Substrate Assembly.  
Encapsulation  
View  
Die  
9/6/2002  
Version 2.0  
Page32  
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