PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Mechanical Dimensions of the PowerPC 740 255 CBGA Package
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature of the 255 CBGA Package
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
2X
Top View
0.2
DESIGNATED WITH A BALL MISSING FROM
THE ARRAY.
D
A
A1 CORNER
MILLIMETERS
DIM MIN
2.45
A1 0.80
A2 0.90
MAX
3.00
1.00
1.10
0.93
A
b
D
D1
e
0.82
21.00 BSC
5.443 BSC
1.27 BSC
E
E1
E
E1
21.00 BSC
8.075 BSC
C
0.15 C
2X
0.2
D1
B
A1 CORNER
1
2 3 4 5 6 7 8 9 10111213141516
There is no ball
A
B
C
D
E
F
G
H
J
in the A01 position
e/2
X-ray view of balls
from top of package
K
L
M
N
P
R
T
e
0.3 C A B
e/2
A2
A1
C
0.15
255X
b
A
Page 31
Version 2.0
9/6/2002
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