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IBM25PPC750L-GB500AD2R 参数 Datasheet PDF下载

IBM25PPC750L-GB500AD2R图片预览
型号: IBM25PPC750L-GB500AD2R
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
Mechanical Dimensions of the PowerPC 740 255 CBGA Package  
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature of the 255 CBGA Package  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. DIMENSIONS IN MILLIMETERS.  
3. TOP SIDE A1 CORNER INDEX IS A  
METALIZED FEATURE WITH VARIOUS  
SHAPES. BOTTOM SIDE A1 CORNER IS  
2X  
Top View  
0.2  
DESIGNATED WITH A BALL MISSING FROM  
THE ARRAY.  
D
A
A1 CORNER  
MILLIMETERS  
DIM MIN  
2.45  
A1 0.80  
A2 0.90  
MAX  
3.00  
1.00  
1.10  
0.93  
A
b
D
D1  
e
0.82  
21.00 BSC  
5.443 BSC  
1.27 BSC  
E
E1  
E
E1  
21.00 BSC  
8.075 BSC  
C
0.15 C  
2X  
0.2  
D1  
B
A1 CORNER  
1
2 3 4 5 6 7 8 9 10111213141516  
There is no ball  
A
B
C
D
E
F
G
H
J
in the A01 position  
e/2  
X-ray view of balls  
from top of package  
K
L
M
N
P
R
T
e
0.3 C A B  
e/2  
A2  
A1  
C
0.15  
255X  
b
A
Page 31  
Version 2.0  
9/6/2002  
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