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IBM25PPC750L-GB500AD2R 参数 Datasheet PDF下载

IBM25PPC750L-GB500AD2R图片预览
型号: IBM25PPC750L-GB500AD2R
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
Mechanical Dimensions of the PowerPC 750 360 CBGA Package  
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature of the 360 CBGA Package  
2X  
0.2  
Top View  
NOTES:  
A
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. DIMENSIONS IN MILLIMETERS.  
3. TOP SIDE A1 CORNER INDEX IS A  
METALIZED FEATURE WITH VARIOUS  
SHAPES. BOTTOM SIDE A1 CORNER IS  
DESIGNATED WITH A BALL MISSING FROM  
THE ARRAY.  
CAPACITOR  
D1  
MILLIMETERS  
CHIP  
E3  
E2  
DIM  
A
Minimum  
2.65  
Maximum  
3.20  
E1  
E
A1  
A2  
b
0.80  
1.00  
E2  
E3  
1.10  
1.30  
0.82  
0.93  
D
25.00 BSC  
D1  
D2  
D3  
e
5.443  
2.48  
D2  
D3  
D2  
6.3  
D3  
1.27 BSC  
25.00 BSC  
8.075  
E
2X  
E1  
E2  
E3  
0.2  
A01 Corner Locator  
2.48  
B
7.43  
A01 Corner  
C
19 18 17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0.15  
C
W
V
U
T
R
P
N
M
L
X-ray view of balls  
from top of package  
K
J
H
G
F
E
D
C
B
A
(18x)  
e
There is no ball in the A01 position  
(18x)  
A2  
A1  
360X  
b
A01 Corner  
0.3 C A B  
0.15  
A
C
Not To Scale  
Note: All caps on the SCM are lower in height than the processor die.  
9/6/2002  
Version 2.0  
Page36  
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