PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Thermal Management Information
This section provides thermal management information for the CBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package, and
mounting clip and screw assembly. See Figure 21.
Figure 21. Package Exploded Cross-Sectional View with Several Heat Sink Options
CBGA Package
Heat Sink
Heat Sink clip
Adhesive
or
Thermal
Interface
Material
Printed
Circuit
Board
Option
Maximum Heatsink Weight Limit for the 360 CBGA
Force
Maximum (pounds)
Dynamic Compression
Dynamic Tensile
10.0
2.5
Static Constant (Spring Force)
8.2
Page 45
Version 2.0
9/6/2002
IBM [ IBM ]
