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IBM25PPC750L-GB500AA2ST 参数 Datasheet PDF下载

IBM25PPC750L-GB500AA2ST图片预览
型号: IBM25PPC750L-GB500AA2ST
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
Thermal Management Information  
This section provides thermal management information for the CBGA package for air cooled applications.  
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air  
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached  
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package, and  
mounting clip and screw assembly. See Figure 21.  
Figure 21. Package Exploded Cross-Sectional View with Several Heat Sink Options  
CBGA Package  
Heat Sink  
Heat Sink clip  
Adhesive  
or  
Thermal  
Interface  
Material  
Printed  
Circuit  
Board  
Option  
Maximum Heatsink Weight Limit for the 360 CBGA  
Force  
Maximum (pounds)  
Dynamic Compression  
Dynamic Tensile  
10.0  
2.5  
Static Constant (Spring Force)  
8.2  
Page 45  
Version 2.0  
9/6/2002  
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