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IBM25PPC750L-GB500AA2ST 参数 Datasheet PDF下载

IBM25PPC750L-GB500AA2ST图片预览
型号: IBM25PPC750L-GB500AA2ST
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2  
resistance approximately 7 times greater than the thermal grease joint.  
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see  
Figure 21). Therefore the synthetic grease offers the best thermal performance, considering the low interface  
pressure. Of course, the selection of any thermal interface material depends on many factors—thermal per-  
formance requirements, manufacturability, service temperature, dielectric properties, cost, etc.  
Figure 23. Thermal Performance of Select Thermal Interface Material  
Silicone Sheet (0.006 inch)  
+
Bare Joint  
Floroether Oil Sheet (0.007 inch)  
Graphite/Oil Sheet (0.005 inch)  
Synthetic Grease  
2
+
+
1.5  
+
1
0.5  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
Contact Pressure (PSI)  
Heat sink adhesive materials should be selected based upon high conductivity, yet adequate mechanical  
strength to meet equipment shock/vibration requirements.  
The following section provides a heat sink selection example using one of the commercially available heat  
sinks.  
Page 47  
Version 2.0  
9/6/2002  
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