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IBM25PPC750L-GB500AA2ST 参数 Datasheet PDF下载

IBM25PPC750L-GB500AA2ST图片预览
型号: IBM25PPC750L-GB500AA2ST
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360,]
分类和应用: 外围集成电路
文件页数/大小: 54 页 / 1135 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Microprocessor  
Heat Sink Selection Example  
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows.  
TJ = TA + TR + (θJC + θINT + θSA) × PD  
Where:  
TJ is the die-junction temperature  
TA is the inlet cabinet ambient temperature  
TR is the air temperature rise within the system cabinet  
θJC is the junction-to-case thermal resistance  
θINT is the thermal resistance of the thermal interface material  
θSA is the heat sink-to-ambient thermal resistance  
PD is the power dissipated by the device  
Typical die-junction temperatures (TJ) should be maintained less than the value specified in Table “Package  
Thermal Characteristics1,” on page 11. The temperature of the air cooling the component greatly depends  
upon the ambient inlet air temperature and the air temperature rise within the computer cabinet. An electronic  
cabinet inlet-air temperature (TA) may range from 30 to 40°C. The air temperature rise within a cabinet (TR)  
may be in the range of 5 to 10°C. The thermal resistance of the interface material (θINT) is typically about 1°C/  
W. Assuming a TA of 30°C, a TR of 5°C, a CBGA package θJC = 0.03, and a power dissipation (PD) of 5.0 watts,  
the following expression for TJ is obtained.  
Die-junction temperature: TJ = 30°C + 5°C + (0.03°C/W +1.0°C/W + θSA) × 5W  
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (θSA) versus air flow velocity  
is shown in Figure 24.  
9/6/2002  
Version 2.0  
Page 48  
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