Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
Figure 5-7. Package Exploded Cross-Sectional View with Several Heat-Sink Options
CBGA Package
Heat Sink
Heat Sink Clip
Adhesive
or
Thermal
Interface
Material
Printed
Circuit
Board
Option
Table 5-7. Maximum Heat-Sink Weight Limit for the CBGA
Force
Maximum
42.9 N
9.05 N
22.4 N
39 g
Notes
Maximum dynamic compressive force allowed on the BGA balls
Maximum dynamic tensile force allowed on the BGA balls
Maximum dynamic compressive force allowed on the chip
Maximum mass of module + heat sink when heat sink is not bolted to card
Maximum torque on die (or substrate)
1
2
3
4
28in-lbs
1. The maximum instantaneous compressive force distributed across the module surface, and perpendicular to the surface of the
board on which it is mounted.
2. The maximum instantaneous tensile force exerted across the module surface, and perpendicular to the surface of the board on
which it is mounted.
3. The maximum instantaneous compressive force distributed across the die surface, and perpendicular to the surface of the board
on which it is mounted.
4. The maximum combined mass of the module, attached heat sink or spreader, and adhesive material used to secure or support the
heat sink or spreader to the module’s ceramic surface.
The board designer can choose between several types of heat sinks to place on the 750GX. There are
several commercially-available heat sinks for the 750GX provided by the vendors listed in Table 5-8, 750GX
Heat-Sink Vendors, on page 63.
System Design Information
Page 62 of 73
750GX_ds_body.fm SA14-2765-02
September 2, 2005
IBM [ IBM ]
