Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
Figure 5-6. IBM RISCWatch JTAG to HRESET, TRST, and SRESET Signal Connector
HRESET from RISCWatch
HRESET to PowerPC 750GX
TRST to PowerPC 750GX
System HRESET
TRST from RISCWatch
SRESET from RISCWatch
System SRESET
SRESET to PowerPC 750GX
Note: See notes for Table 5-6, Input/Output Usage, on page 57.
5.7 Thermal Management Information
This section provides thermal management information for the CBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package,
mounting clip, or a screw assembly (see Figure 5-7, Package Exploded Cross-Sectional View with Several
Heat-Sink Options, on page 62).
Note: This section is based on preliminary information and is subject to change.
750GX_ds_body.fm SA14-2765-02
September 2, 2005
System Design Information
Page 61 of 73
IBM [ IBM ]
