Data Sheet
PowerPC® 750CXe RISC Microprocessor
Preliminary
5. PowerPC 750CXe Dimension and Physical Signal Assignments
IBM offers a plastic ball grid array, PBGA, which supports 256 balls as the PowerPC 750CXe package. This
package is JEDEC MSL-3 and should be handled accordingly.
Note: Use the A01 corner designator for correct placement. The A01 corner identifier dot is approxi-
mately 1.27 mm in diameter and is marked on the top of the part. Some packages also have a chamfer on
the A01 corner, as shown in Figure 5-1.
The following sections contain several views of the package, pin information, and a pin listing.
Figure Description
Figure Number and Page
Shows the pinout of the 256 PBGA package as viewed from the solder ball surface.
Figure 5-1 on page 19
Shows a side profile of the 256 PBGA package including the height from the top of the cop-
per heat spreader to the bottom of the solder balls.
Figure 5-2 on page 20
Figure 5-3 on page 20
Provides a more detailed side profile including the encapsulant (glob) referenced.
PowerPC 750CXe Dimension and Physical Signal Assignments
Page 18 of 36
750cxe_DD3.1_Dev_3_gen_mkt.fm.1.5
April 8, 2004
IBM [ IBM ]
