level. Unused active low inputs should be tied to Vdd. Unused active high inputs should be
connected to GND.
1.8.6 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent upon the
system-level design—the heat sink, airflow and thermal interface material. To reduce the die-
junction temperature, heat sinks may be attached to the package by several methods—adhesive,
spring clip to holes in the printed-circuit board or package, and mounting clip and screw assembly;
see Figure 12. This spring force should not exceed 5.5 pounds of force.
CBGA Package
Heat Sink
Heat Sink
Clip
Adhesive
or
Thermal Interface Material
Printed-Circuit Board
Option
Figure 12. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the 604e. There
are several commercially-available heat sinks for the 604e provided by the following vendors:
Thermalloy
2021 W. Valley View Lane
P.O. Box 810839
214-243-4321
Dallas, TX 75731
International Electronic Research Corporation (IERC)
135 W. Magnolia Blvd.
Burbank, CA 91502
818-842-7277
Aavid Engineering
One Kool Path
603-528-3400
Laconic, NH 03247-0440
Wakefield Engineering
60 Audubon Rd.
617-245-5900
Wakefield, MA 01880
24
PID9q-604e Hardware Datasheet
IBM
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
IBM [ IBM ]
