tors m igh t in clu de air flow, board popu lation (local h eat flu x of adjacen t com pon en ts),
h eat sin k efficien cy, h eat sin k attach , n ext-level in tercon n ect tech n ology, system air
tem peratu re rise, etc.
9.0 Ordering Information
Th is section provides th e part n u m berin g n om en clatu re for th e PPC740 an d PPC750.
Note th at th e in dividu al part n u m bers correspon d to a m axim u m processor core fre-
qu en cy. For available frequ en cies, con tact you r local IBM sales office.
In addition to th e processor frequ en cy an d bu s ratio, th e part n u m berin g sch em e also
con sists of a part m odifier. Th e part m odifier allows for th e availability of fu tu re
en h an ced parts (th at is, lower voltage, lower power, h igh er perform an ce, etc.).
Each part n u m ber also con tain s a revision code. Th is refers to th e die m ask revision
n u m ber an d is specified in th e part n u m berin g sch em e for iden tification pu rposes on ly.
Figu re 23 provides th e IBM part n u m berin g n om en clatu re for th e PPC740 an d
PPC750.
IBM25EMPPC7XXXBUXXXX0
Tray Shipping Container
PPC740 or PPC750 Family
Processor Frequency
Revision Level (DD2.1)
Package (BGA)
Applic. Conditions:
F = 2.5 ± 5%, 0 - 105C
B = 2.5 - 2.7V, 0 - 105C
Blank Digits
Figure 23. IBM Part Number Key
43 of 44
PPC740 and PPC750 Hardware Specifications
Preliminary and subject to change without notice
IBM [ IBM ]
