tors might include air flow, board population (local heat flux of adjacent components),
heat sink efficiency, heat sink attach, next-level interconnect technology, system air
temperature rise, etc.
9.0 Ordering Information
This section provides the part numbering nomenclature for the PPC740 and PPC750.
Note that the individual part numbers correspond to a maximum processor core fre-
quency. For available frequencies, contact your local IBM sales office.
In addition to the processor frequency and bus ratio, the part numbering scheme also
consists of a part modifier. The part modifier allows for the availability of future
enhanced parts (that is, lower voltage, lower power, higher performance, etc.).
Each part number also contains a revision code. This refers to the die mask revision
number and is specified in the part numbering scheme for identification purposes only.
PPC750.
provides the IBM part numbering nomenclature for the PPC740 and
IBM25EMPPC7XXXBUXXXX0
Tray Shipping Container
PPC740 or PPC750 Family
Revision Level (DD2.1)
Package (BGA)
Blank Digits
Processor Frequency
Applic. Conditions:
F = 2.5
±
5%, 0 - 105C
B = 2.5 - 2.7V, 0 - 105C
Figure 23. IBM Part Number Key
43 of 44
PPC740 and PPC750 Hardware Specifications
Preliminary and subject to change without notice
IBM [ IBM ]
