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IBM0625404GT3B-10E 参数 Datasheet PDF下载

IBM0625404GT3B-10E图片预览
型号: IBM0625404GT3B-10E
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 64MX4, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66]
分类和应用: 动态存储器双倍数据速率光电二极管内存集成电路
文件页数/大小: 75 页 / 1245 K
品牌: IBM [ IBM ]
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IBM0625404GT3B IBM0625164GT3B  
IBM0625804GT3B IBM06254B4GT3B  
256Mb Double Data Rate Synchronous DRAM  
Advance  
Pulldown and Pullup Characteristics  
1. The nominal pulldown V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within  
the inner bounding lines of the V-I curve.  
2. The full variation in driver pulldown current from minimum to maximum process, temperature, and voltage  
lie within the outer bounding lines of the V-I curve.  
Pulldown Characteristics  
140  
Maximum  
120  
100  
Nominal High  
80  
60  
40  
Nominal Low  
Minimum  
20  
0
0
0.5  
1
1.5  
2
2.5  
V
(V)  
OUT  
3. The nominal pullup V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the  
inner bounding lines of the V-I curve.  
4. The full variation in driver pullup current from minimum to maximum process, temperature, and voltage lie  
within the outer bounding lines of the V-I curve.  
Pullup Characteristics  
0
-20  
Minimum  
Nominal Low  
-40  
-60  
-80  
-100  
-120  
-140  
-160  
Nominal High  
Maximum  
0
0.5  
1
1.5  
(V)  
2
2.5  
V
OUT  
5. The full variation in the ratio of the maximum to minimum pullup and pulldown current does not exceed  
1.7, for device drain to source voltages from 0 to V /2.  
DDQ  
6. The full variation in the ratio of the nominal pullup to pulldown current should be unity ± 10%, for device  
drain to source voltages from 0 to V  
/2.  
DDQ  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
29L0011.E36997  
10/99  
Page 52 of 75  
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