HI-6110
THERMAL CHARACTERISTICS
Data taken at VDD = 3.3V, continuous data transmission at 1 Mbit/s, single transmitter enabled.
JUNCTION TEMPERATURE
TA= 25°C TA= 85°C TA= 125°C
PART NUMBER
PACKAGE STYLE
CONDITION
qJA
Mounted on
circuit board
60.9
°C / W
52 pin PQFP
HI-6110PQI / T
56°C
41°C
37°C
116°C
101°C
97°C
156°C
141°C
137°C
Heat sink pad
unsoldered
31.1
°C / W
64 pin LPCC
HI-6110PCI / T
Heat sink pad
soldered
22.8
°C / W
PIN CONFIGURATION (Top View)
-
STR
R / W
CS
1
2
3
4
5
6
7
8
9
48
-
47 BUSA
46 VDDA
45 BUSA
-
44 BUSB
D0
43 VDDB
D1
42 BUSB
HC-6110PCI
HC-6110PCT
D2
41 TXINHB
40 RCVB
D3
D4 10
D5 11
D6 12
D7 13
D8 14
D9 15
39 FFEMPTY
38 RF0 / RCVCMDA
37 RF1 / RCVCMDB
36 RFLAG
35 VALMESS
34 ERROR
33 MR
-
16
64 Pin Leadless Plastic Chip Carrier (LPCC)
See page 1 for 52-pin PQFP Pin Configuration
HOLT INTEGRATED CIRCUITS
34
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
