HI-6110
TRANSMITTER
BUSA/B
1:2.5
55 W
55 W
Tx Data from
Manchester
Encoder
35 W
Point “AD“
BUSA/B
Isolation
Transformer
TXINHA/B
RECEIVER
2.5:1
55 W
55 W
Rx Data to
Manchester
Decoder
Point “AD“
35 W
Isolation
Transformer
Figure 6. Direct Coupled Test Circuits
Point
“AT”
TRANSMITTER
52.5 W
(.75 Zo)
1:2.5
1:1.4
BUSA/B
Tx Data from
Manchester
Encoder
35 W (.5 Zo)
BUSA/B
52.5 W
(.75 Zo)
Isolation
Transformer
Coupling
Transformer
TXINHA/B
Point
“AT”
RECEIVER
52.5 W
(.75 Zo)
1.4:1
2.5:1
Rx Data to
Manchester
Decoder
35 W (.5 Zo)
52.5 W
(.75 Zo)
Coupling
Transformer
Isolation
Transformer
Figure 7. Transformer Coupled Test Circuits
HEAT SINKING THE LEADLESS PLASTIC
CHIP CARRIER PACKAGE
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt MIL-STD-1553 data
communications devices. Layout considerations, as well
as recommended interface and protection components
are included.
The HI-6110PCI/T/M is packaged in a 64 pin leadless
plastic chip carrier (LPCC). This package has a metal
heat sink pad on its bottom surface, which should be
soldered to the printed circuit board for optimum thermal
dissipation. The package heat sink is electrically isolated
and may be soldered to any convenient power plane or
ground plane. Redundant "vias" between the exposed
board surface and buried power or ground plane will
enhance thermal conductivity.
HOLT INTEGRATED CIRCUITS
33
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
