HI-3593
HEAT SINK - CHIP-SCALE PACKAGE ONLY
The HI-3593PCx uses a 44-pin plastic chip-scale package.
This package has a metal heat sink pad on its bottom
surface. This heat sink is electrically isolated from the die.
To enhance thermal dissipation, the heat sink can be
soldered to matching circuit board pad.
ABSOLUTE MAXIMUM RATINGS
Power Dissipation at 25°C
Plastic Quad Flat Pack ............... 1.5 W, derate 10mW/°C
Supply Voltages VDD ......................................... -0.3V to +5.0V
V+ ......................................................... +7.0V
V- ......................................................... -7.0V
DC Current Drain per digital input pin ........................... 10mA
Storage Temperature Range ........................ -65°C to +150°C
Voltage at pins RINxx-xx .................................. -120V to +120V
Voltage at pins TXAOUT, TXBOUT, AMPA, AMPB ......... V- to V+
Voltage at any other pin ............................... -0.3V to VDD +0.3V
Operating Temperature Range (Industrial): ..... -40°C to +85°C
(Hi-Temp): ..... -55°C to +125°C
Solder temperature (Leads) .................... 280°C for 10 seconds
(Package) .......................................... 220°C
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HOLT INTEGRATED CIRCUITS
18
HOLTIC [ HOLT INTEGRATED CIRCUITS ]
