HGTD3N60C3, HGTD3N60C3S
TO-252AA
SURFACE MOUNT JEDEC TO-252AA PLASTIC PACKAGE
INCHES
MIN
MILLIMETERS
A
E
A
SYMBOL
MAX
0.094
0.022
0.032
0.040
0.215
-
MIN
2.19
0.46
0.72
0.84
5.21
4.83
0.46
6.86
6.35
MAX
2.38
0.55
0.81
1.01
5.46
-
NOTES
H
b2
1
1
A
0.086
0.018
0.028
0.033
0.205
0.190
0.018
0.270
0.250
-
SEATING
PLANE
A
4, 5
1
b
4, 5
D
b
b
b
4
1
2
3
L
2
4, 5
2
L
1
3
c
0.022
0.290
0.265
0.55
7.36
6.73
4, 5
b1
b
D
E
e
-
-
L
1
e
c
e1
J
1
0.090 TYP
0.180 BSC
2.28 TYP
4.57 BSC
7
7
-
0.265
(6.7)
e
1
TERM. 4
H
0.035
0.045
0.045
0.115
-
0.89
1.14
1.14
2.92
-
1
1
J
0.040
0.100
0.020
0.025
0.170
1.02
2.54
0.51
0.64
4.32
-
L
-
L
3
0.265 (6.7)
b3
L
L
L
4, 6
3
2
1
2
3
0.040
-
1.01
-
0.070 (1.8)
NOTES:
0.118 (3.0)
1. These dimensions are within allowable dimensions of Rev. B of
JEDEC TO-252AA outline dated 9-88.
BACK VIEW
2. L and b dimensions establish a minimum mounting surface for
3
3
0.063 (1.6)
0.090 (2.3)
0.063 (1.6)
0.090 (2.3)
terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L is the terminal length for soldering.
1
LEAD 1
LEAD 3
TERM. 4
-
-
-
GATE
7. Position of lead to be measured 0.090 inches (2.28mm) from bottom
of dimension D.
EMITTER
COLLECTOR
8. Controlling dimension: Inch.
9. Revision 6 dated 10-96.
8
HARRIS [ HARRIS CORPORATION ]
