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MPX5100AP 参数 Datasheet PDF下载

MPX5100AP图片预览
型号: MPX5100AP
PDF下载: 下载PDF文件 查看货源
内容描述: 集成硅压力传感器片上信号调节,温度补偿和校准 [Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated]
分类和应用: 传感器换能器压力传感器温度补偿
文件页数/大小: 12 页 / 318 K
品牌: FREESCALE [ Freescale ]
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7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when sugected to  
a specified step change in pressure.  
8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.  
9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING  
Figure 2 shows the sensor output signal relative to  
pressure input. Typical, minimum, and maximum output  
curves are shown for operation over a temperature range of  
0× to 85×C using the decoupling circuit shown in Figure 4.  
The output will saturate outside of the specified pressure  
range.  
Figure 3 illustrates both the Differential/Gauge and the  
Absolute Sensing Chip in the basic chip carrier (Case 867). A  
fluorosilicone gel isolates the die surface and wire bonds from  
the environment, while allowing the pressure signal to be  
transmitted to the sensor diaphragm.  
The MPX5100 series pressure sensor operating  
characteristics, and internal reliability and qualification tests  
are based on use of dry air as the pressure media. Media,  
other than dry air, may have adverse effects on sensor  
performance and long-term reliability. Contact the factory for  
information regarding media compatibility in your application.  
5
4
Vout = VS*(0.009*P+0.04)  
(Pressure Error * Temperature Factor * 0.009 * VS  
VS = 5.0 V 0.25 Vdc  
PE = 2.5  
TM = 1  
TEMP = 0 to 85°C  
3
2
1
0
MAX  
TYP  
MIN  
Pressure (kPa)  
(Typ)  
Offset  
Figure 2. Output Vs. Pressure Differential  
Stainless Steel  
Fluorosilicone Gel  
Stainless Steel  
Fluorosilicone  
Metal Cover  
Die Coat  
Gel Die Coat  
Die  
Metal Cover  
Die  
Epoxy Plastic  
Case  
Epoxy Plastic  
Wire Bond  
Wire Bond  
Case  
Die Bond  
Die Bond  
Lead Frame  
Lead Frame  
Differential/Gauge Element  
Absolute Element  
Figure 3. Cross Sectional Diagrams (Not to Scale)  
Figure 4 shows the recommended decoupling circuit for  
interfacing the output of the integrated sensor to the A/D input  
of a microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
+
5.0 V  
V
OUTPUT  
OUT  
Vs  
IPS  
GND  
1.0 µF  
0.01  
µ
F
470 pF  
Figure 4. Recommended Power Supply Decoupling and Output Filtering  
(For additional output filtering, please refer to Application Note AN1646.)  
MPX5100  
Sensors  
Freescale Semiconductor  
3