PACKAGE DIMENSIONS
-A-
D 8 PL
4
1
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
0.25 (0.010)
T
B
5
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
8
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
-A-
4
5
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
N
-B-
D 8 PL
G
M
S
S
A
INCHES
MILLIMETERS
8
0.25 (0.010)
T B
1
DIM MIN MAX MIN
MAX
10.79
10.79
13.21
0.864
A
B
C
D
G
J
K
M
N
S
0.415
0.425 10.54
0.425 10.54
0.520 12.70
DETAIL X
0.415
0.500
0.026
S
W
0.034
0.66
0.100 BSC
2.54 BSC
0.009
0.100
0˚
0.011
0.120
15˚
0.23
2.54
0˚
0.28
3.05
15˚
V
PIN 1
IDENTIFIER
0.444
0.540
0.245
0.115
0.448 11.28
0.560 13.72
11.38
14.22
6.48
3.17
C
V
W
0.255
0.125
6.22
2.92
SEATING
PLANE
-T-
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX5100
Sensors
Freescale Semiconductor
7
FREESCALE [ Freescale ]
