PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
R
POSITIVE PRESSURE
(P1)
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
B
-A-
INCHES
DIM MIN MAX MIN
MILLIMETERS
N
L
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
PIN 1
1
2
3
4
5
6
0.514
0.200
0.027
0.048
SEATING
PLANE
-T-
0.220
0.033
0.064
5.08
0.68
1.22
0.84
1.63
G
J
S
G
J
L
M
N
R
S
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
D 6 PL
0.136 (0.005)
30˚ NOM
30˚ NOM
M
M
T A
0.475
0.430
0.090
0.495 12.07
0.450 10.92
12.57
11.43
2.66
0.105
2.29
STYLE 1:
PIN 1. VOUT
2. GROUND
STYLE 2:
PIN 1. OPEN
2. GROUND
STYLE 3:
PIN 1. OPEN
2. GROUND
3. VCC
4. V1
5. V2
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. VEX
6. OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
NOTES:
A
U
L
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
SEATING PLANE
T
R
MILLIMETERS
V
DIM MIN
MAX
29.85
18.16
8.26
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
29.08
17.4
7.75
0.68
1.22
Q
N
0.84
1.63
Q
2.54 BSC
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.1
B
1
6
2
5
3
4
K
P
PIN 1
S
23.11 BSC
P
C
4.62
4.93
G
6X
D
0.173
M
M
0.25
T Q
J
F
M
S
S
Q
T P
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
CASE 867B-04
ISSUE F
UNIBODY PACKAGE
MPX5100
Sensors
Freescale Semiconductor
8
FREESCALE [ Freescale ]
