Package and Pin Listings
18.4 Mechanical Dimensions for the MPC8347EA PBGA
Figure 41 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA,
620-PBGA package.
Notes:
1. All dimensions are in millimeters.
2. Dimensioning and tolerancing per ASME Y14. 5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Figure 41. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA PBGA
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
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Freescale Semiconductor