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MPC8347ECVVAGDB 参数 Datasheet PDF下载

MPC8347ECVVAGDB图片预览
型号: MPC8347ECVVAGDB
PDF下载: 下载PDF文件 查看货源
内容描述: MPC8347EA的PowerQUICC II Pro整合型主机处理器的硬件规格 [MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications]
分类和应用: 外围集成电路PC时钟
文件页数/大小: 99 页 / 727 K
品牌: FREESCALE [ Freescale ]
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Package and Pin Listings  
18.2 Mechanical Dimensions for the MPC8347EA TBGA  
Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA,  
672-TBGA package.  
Notes:  
1. All dimensions are in millimeters.  
2. Dimensions and tolerances per ASME Y14.5M-1994.  
3. Maximum solder ball diameter measured parallel to datum A.  
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.  
5. Parallelism measurement must exclude any effect of mark on top surface of package.  
Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA TBGA  
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12  
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Freescale Semiconductor