Power Characteristics
1
Table 4. MPC8347EA Power Dissipation (continued)
Core
Frequency
(MHz)
CSB
Frequency
(MHz)
,
Typical at TJ = 65
Typical2 3
Maximum4
Unit
TBGA
333
333
166
266
133
300
150
333
166
266
133
333
2.0
1.8
2.1
1.9
2.3
2.1
2.4
2.2
2.4
2.2
3.5
3.0
2.8
3.0
2.9
3.2
3.0
3.3
3.1
3.3
3.1
4.6
3.2
2.9
3.3
3.1
3.5
3.2
3.6
3.4
3.6
3.4
5
W
W
W
W
W
W
W
W
W
W
W
400
450
500
533
6675,6
1
2
The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Table 5.
Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
3
4
5
6
Thermal solutions may need to design to a value higher than typical power based on the end application, TA target, and I/O
power.
Maximum power is based on a voltage of VDD = 1.2 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark
application.
Maximum power is based on a voltage of VDD = 1.3 V, worst case process, a junction temperature of TJ = 105°C, and an
artificial smoke test.
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
11
FREESCALE [ Freescale ]
