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MK51DX256CLK7 参数 Datasheet PDF下载

MK51DX256CLK7图片预览
型号: MK51DX256CLK7
PDF下载: 下载PDF文件 查看货源
内容描述: K51次家庭 [K51 Sub-Family]
分类和应用:
文件页数/大小: 77 页 / 1911 K
品牌: FREESCALE [ Freescale ]
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Peripheral operating requirements and behaviors  
2.  
3.  
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental  
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the  
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.  
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental  
Conditions—Forced Convection (Moving Air) with the board horizontal. For the LQFP, the board meets the JESD51-7  
specification.  
4.  
5.  
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental  
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.  
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate  
temperature used for the case temperature. The value includes the thermal resistance of the interface material  
between the top of the package and the cold plate.  
6.  
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental  
Conditions—Natural Convection (Still Air).  
6 Peripheral operating requirements and behaviors  
6.1 Core modules  
6.1.1 Debug trace timing specifications  
Table 11. Debug trace operating behaviors  
Symbol  
Description  
Min.  
Max.  
Unit  
Tcyc  
Clock period  
Frequency dependent  
MHz  
Twl  
Twh  
Tr  
Low pulse width  
High pulse width  
Clock and data rise time  
Clock and data fall time  
Data setup  
2
2
3
ns  
ns  
ns  
ns  
ns  
ns  
3
Tf  
3
Ts  
Th  
Data hold  
2
Figure 4. TRACE_CLKOUT specifications  
K51 Sub-Family Data Sheet, Rev. 2, 4/2012.  
Freescale Semiconductor, Inc.  
23