General
5.4.1 Thermal operating requirements
Table 10. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
85
°C
5.4.2 Thermal attributes
Board type
Symbol
Description
81 MAPBGA 80 LQFP
Unit
Notes
Single-layer
(1s)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
74
42
62
38
23
51
36
41
30
20
°C/W
1, 2
1, 3
1,3
1,3
4
Four-layer
(2s2p)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
°C/W
°C/W
°C/W
°C/W
Single-layer
(1s)
RθJMA
RθJMA
RθJB
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Four-layer
(2s2p)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
—
Thermal
resistance,
junction to
board
—
—
RθJC
Thermal
resistance,
junction to case
19
4
10
2
°C/W
°C/W
5
6
ΨJT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
K51 Sub-Family Data Sheet, Rev. 2, 4/2012.
22
Freescale Semiconductor, Inc.
FREESCALE [ Freescale ]
