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MK20DX64VLH5 参数 Datasheet PDF下载

MK20DX64VLH5图片预览
型号: MK20DX64VLH5
PDF下载: 下载PDF文件 查看货源
内容描述: K20次家庭 [K20 Sub-Family]
分类和应用:
文件页数/大小: 62 页 / 1753 K
品牌: FREESCALE [ Freescale ]
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Peripheral operating requirements and behaviors  
Board type  
Symbol  
Description  
64 MAPBGA 64 LQFP  
Unit  
Notes  
Single-layer  
(1s)  
RθJMA  
Thermal  
resistance,  
junction to  
ambient (200 ft./  
min. air speed)  
90  
51  
31  
53  
40  
28  
°C/W  
1,3  
Four-layer  
(2s2p)  
RθJMA  
Thermal  
resistance,  
junction to  
ambient (200 ft./  
min. air speed)  
°C/W  
°C/W  
,
RθJB  
Thermal  
resistance,  
junction to  
board  
5
RθJC  
Thermal  
resistance,  
junction to case  
31  
6
15  
3
°C/W  
°C/W  
6
7
ΨJT  
Thermal  
characterization  
parameter,  
junction to  
package top  
outside center  
(natural  
convection)  
1.  
2.  
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site  
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board  
thermal resistance.  
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental  
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the  
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.  
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental  
Conditions—Forced Convection (Moving Air) with the board horizontal.  
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental  
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.  
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate  
temperature used for the case temperature. The value includes the thermal resistance of the interface material  
between the top of the package and the cold plate.  
3.  
5.  
6.  
7.  
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental  
Conditions—Natural Convection (Still Air).  
6 Peripheral operating requirements and behaviors  
6.1 Core modules  
K20 Sub-Family Data Sheet, Rev. 4 5/2012.  
22  
Freescale Semiconductor, Inc.  
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