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MC7445ARX933LF 参数 Datasheet PDF下载

MC7445ARX933LF图片预览
型号: MC7445ARX933LF
PDF下载: 下载PDF文件 查看货源
内容描述: RISC微处理器硬件规格 [RISC Microprocessor Hardware Specifications]
分类和应用: 微处理器
文件页数/大小: 64 页 / 1129 K
品牌: FREESCALE [ Freescale ]
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Electrical and Thermal Characteristics  
The L3_CLK timing diagram is shown in Figure 7.  
t
t
L3CF  
L3CR  
t
L3_CLK  
t
CHCL  
L3_CLK0  
L3_CLK1  
VM  
VM  
VM  
VM  
VM  
VM  
VM  
t
L3CSKW1  
For PB2 or Late Write:  
L3_ECHO_CLK1  
VM  
VM  
VM  
VM  
VM  
VM  
VM  
VM  
t
L3CSKW2  
L3_ECHO_CLK3  
t
L3CSKW2  
Figure 7. L3_CLK_OUT Output Timing Diagram  
5.2.4 L3 Bus AC Specifications  
The MPC7455 L3 interface supports three different types of SRAM: source-synchronous, double data rate (DDR)  
MSUG2 SRAM, late write SRAMs, and pipeline burst (PB2) SRAMs. Each requires a different protocol on the L3  
interface and a different routing of the L3 clock signals. The type of SRAM is programmed in L3CR[22:23] and the  
MPC7455 then follows the appropriate protocol for that type. The designer must connect and route the L3 signals  
appropriately for each type of SRAM. Following are some observations about the chip-to-SRAM interface.  
The routing for the point-to-point signals (L3_CLK[0:1], L3DATA[0:63], L3DP[0:7], and  
L3_ECHO_CLK[0:3]) to a particular SRAM should be delay matched. If necessary, the length of traces can  
be altered in order to intentionally skew the timing and provide additional setup or hold time margin.  
For a 1-Mbyte L3, use address bits 16:0 (bit 0 is LSB).  
No pull-up resistors are required for the L3 interface.  
For high speed operations, L3 interface address and control signals should be a ‘T’ with minimal stubs to  
the two loads; data and clock signals should be point-to-point to their single load. Figure 8 shows the AC  
test load for the L3 interface.  
Output  
GV /2  
DD  
Z = 50 Ω  
0
R = 50 Ω  
L
Figure 8. AC Test Load for the L3 Interface  
In general, if routing is short, delay-matched, and designed for incident wave reception and minimal reflection, there  
is a high probability that the AC timing of the MPC7455 L3 interface will meet the maximum frequency operation  
of appropriately chosen SRAMs. This is despite the pessimistic, guard-banded AC specifications (see Table 12,  
Table 13, and Table 14), the limitations of functional testers described in Section 5.2.3, “L3 Clock AC  
Specifications,” and the uncertainty of clocks and signals which inevitably make worst-case critical path timing  
analysis pessimistic.  
MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1  
Freescale Semiconductor  
21  
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