Freescale Semiconductor, Inc.
Me c ha nic a l Sp e c ific a tions
16.3 20-Pin Pla stic Dua l In-Line Pa c ka g e (Ca se 738)
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
20
1
11
10
B
3. DIMENSION
L
FORMED PARALLEL.
TO CENTER OF LEAD WHEN
4. DIMENSION
FLASH.
B
DOES NOT INCLUDE MOLD
C
L
INCHES
MIN MAX
1.010 1.070 25.66 27.17
MILLIMETERS
DIM
A
B
C
D
E
MIN MAX
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
0.050 0.070
0.100 BSC
6.10
3.81
0.39
6.60
4.57
0.55
-T-
SEATING
PLANE
K
M
1.27 BSC
1.77
1.27
F
E
N
G
J
2.54 BSC
0.008 0.015
0.110 0.140
0.300 BSC
0.21
2.80
0.38
3.55
G
F
J 20 PL
K
L
7.62 BSC
0.25 (0.010M)
D 20 PL
M
T B
0°
0.020 0.040
15°
0°
0.51
15°
1.01
M
N
M
M
T A
0.25 (0.010)
16.4 20-Pin Sm a ll Outline Inte g ra te d Circ uit (Ca se 751D)
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
20
11
3. DIMENSIONS
A
AND
MOLD PROTRUSION.
B
DO NOT INCLUDE
-B-
P 10 PL
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
M
0.010 (0.25M)
B
5. DIMENSION
D
DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
1
10
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
AT MAXIMUM MATERIAL CONDITION.
DIMENSION
D 20 PL
J
F
MILLIMETERS INCHES
MIN MAX MIN MAX
0.010 (0.25M)
T
A
B
S
S
DIM
A
12.65 12.95
0.499 0.510
0.292 0.299
0.093 0.104
0.014 0.019
0.020 0.035
0.050 BSC
B
7.40
2.35
0.35
0.50
7.60
2.65
0.49
0.90
C
D
F
R X 45°
1.27 BSC
G
J
0.25
0.10
0.32
0.25
7°
0.010 0.012
0.004 0.009
K
C
M
P
0°
0° 7°
0.395 0.415
10.05 10.55
0.25 0.75
-T-
SEATING
PLANE
R
0.010 0.029
M
K
G 18 PL
General Release Specification
MC68HC705JJ7/MC68HC705JP7 — Rev. 2.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
FREESCALE [ Freescale ]
